Projectiondesign Action one mk III Guía de usuario Pagina 35
- Pagina / 68
- Tabla de contenidos
- MARCADORES
- Processing 1
- Introduction 3
- Contents 4
- Technical specifi cations 61 6
- Table of fi gures 65 6
- Best practice 7
- GENERAL WARNINGS 9
- WEEE INFORMATION 9
- WARNING ABOUT SUBSTANCES 10
- What’s in the box? 11
- Installation and setup 14
- System overview 15
- Network settings 15
- Software 15
- Figure 5-2. Rack mount plate 16
- Figure 5-3. Rack mounted 16
- Getting to know the GUI 18
- MIPS Calibrator – Device View 19
- Clearing calibration 22
- Performing software upgrades 23
- Controlling EDID information 23
- Figure 6-15. MIPS Navigator 25
- MIPS operational states 27
- Auto state 28
- Geometry correction 29
- Scaling fi lters 30
- Lanczos fi lter 31
- B-spline fi lter 31
- C-spline fi lter 31
- Linear interpolation fi lter 31
- Fine tuning control points 35
- Edge blending 37
- fi t have been done 40
- Test patterns 43
- Circle test pattern 44
- Grid (Pixel) test pattern 45
- Grid (Angle) test pattern 46
- Black Level Management 47
- Removing BLM zones 49
- Adding areas to clip 52
- Removing clip areas 54
- Storing and recalling data 56
- Technical specifi cations 61
- Mechanical 62
- Environmental 63
- Table of fi gures 65
- 66Name of Chapter 66
- 601-0206-00 67
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